Transactions on Engineering and Computer Science
Co-Editors-in-Chief
WEI WEI
weiwei[at]xaut.edu.cnAssociate Professor, School of Computer Science and Engineering,
Xi’an University of Technology, Xi’an 710048, PR China.
Ashraf Darwish
ashraf.darwish.eg[at]ieee.orgMathematics Department, Faculty of Science, Helwan University, Cairo,
Egypt, W 43rd Street, 2024, 90062, LA, CA, USA
Editorial Board Members
Bo Cheng
chengbo[at]bupt.edu.cnProfessor of State Key Laboratory of Networking and Switching
Technology, Beijing University of Posts and Telecommunications,
Beijing, China
Takaaki Musha
takaaki.mushya[at]gmail.comDepartment of Mechanical Engineering
Shinshu University, Japan
Vinay Singh (Lead Guest Editor)
usavinaysingh@yahoo.comProf. Sr Manager IT & Software, Colorado, USA
Alhuseen Omar Nori Alsayed
aoalsayd[at]kau.edu.saDeanship of Scientific Research,
Kink Abdul Aziz University, Saudi Arabia
S Kumar Chandar
kumar.chandar[at]christuniversity.inDepartment of Computer Science
School of Business & Management CHRIST
(Deemed to be University), Bangalore, Karnataka, India
Hamid R. Parsaei
hamid.parsaei[At]tamu.eduProfessor, Department of Industrial and Systems Engineering, College Station
Texas, United States
Shang-Ming Zhou
shangming.zhou[AT]plymouth.ac.uk
Volodymyr V. Kovalchuk
lslvvvas[at]ukr.netProfessor of Computer Science, Department of the Environmental State University (Odessa)
Odessa, Ukraine
Mohammad Abu Omar
mmdabuomar[at]yahoo.com
Journal Information
- Journal Name: Transactions on Engineering and Computer Science
- Journal Short Name: Trans Eng Comput Sci
- Language: English
- Format of Publication: Online
- Starting Year: 2020
- Focus Subject: Engineering and Computer Science
- Publication Model: Online
- Frequency of Publication: Two Issue a Year
- Review Process: Single blind peer-review by referees
- Time to 1st Decision: 2 to 3 weeks from date of submission
- Time to Acceptance: 4 to 6 weeks, depending upon the required revision cycles
- Time to Publication: 1 to 3 weeks from date of final submission in the forthcoming issue
- DOI Prefix: 10.7620
Indexed and Abstracted In
